At present, our mass-produced Superplanar^TM Low VF rectifier bridges are mainly packaged in GBJ and GBU, with forward current of 10a, 15a, 25a and 30a, and reverse voltage of 600V and 800V.

Product features：

1. Compared with GPP chip, Superplanar^TM chip has smaller VF and larger IFSM.
2. High current capability, low forward voltage drop. Low power consumption and high efficiency. Good consistency of parameters and stable leakage at high temperature.
3. Chip self-produced, can effectively control technology and cost.

Scope of application:

High power rectifier