Responsibilities:

1、Developments of power semiconductor chip (IGBT/MOSFET/FRD) , not limited to silicon-based, silicon carbide, gallium nitride, gallium oxide, etc.: including mechanism study, structure design, layout design, performance and process simulation, performance tuning and parameter optimisation, lifetime design, reliability verification, failure mechanism study;

2、Keep daily communication with domestic and foreign FAB factories, and obtain flow capacity allocation;

3、Responsible for analysing and forecasting the trends of product technology development, and leading the initiation of corresponding technology reserves;

4、Improve the quality and reliability of products and increase the yield rate of mass-produced products.

Requirements:

1、Master degree or above, majoring in Microelectronics and Solid State Electronics/Integrated Circuits/Electronic Science and Technology/Electronic Communication, preferably from famous foreign universities, 985 or 211 universities;

2、Experience in power device chip design and key technology development, familiar with power device design methodology and processing technology;

3、Familiar with power device development and test flow, test plan design, flow chip technology, requirement definition, design and verification methodology;

4、Good English speaking and writing skills;

5、Proficient in semiconductor design simulation software such as Silvaco, Ansys, MatLab;

6、Good at communication, with strong execution, resilience and co-ordination skills;

7、More than 3 years of experience in power device product development. Experience in power semiconductor device project establishment and implementation is preferred.

Responsibilities:

1、Responsible for power management or battery management chip product or module circuit design and development;

2、Instruct layout engineers in layout work;

3、Pay close attention to the most cutting-edge technologies and products in the field of PMIC and BMS, and make suggestions on the technical direction and product planning of product lines;

4、Evaluate, simulate, and analyse power supply structures and circuit topologies；

5、Collaborate with AE Application Engineer/PE Process Engineer for product testing and application solution development, defining optimal characteristics and test conclusions;

6、Improve the quality and reliability of products and increase the yield rate of mass-produced products.

Requirements:

1、Master degree or above, majoring in Microelectronics and Solid State Electronics/Integrated Circuits/Electronic Science and Technology/Electronic Communication, preferably from famous foreign universities, 985 or 211 universities;

2、More than 5 years of power management chip related design experience, overseas chip design experience is preferred;

3、Familiar with CMOS process, high voltage process and BCD process;

4、Experience in designing automotive-grade power management chips is preferred;

5、Team management experience, strong teamwork spirit, experience working in a project based, product orientated team;

6、Concerned about the research of cutting-edge technology, pay attention to technical details, independent development and design, dare to challenge the breakthrough of the existing technical framework and structure;

7、International perspective and teamwork skills, good written and verbal communication skills in English.

Responsibilities:

1、Responsible for motor driver chip product or module circuit design and development; complete the design of Amplifier, HALL Sensor, LDO, OSC, DRIVER and other related Motor Driver analogue circuits based on the process;

2、Instruct layout engineers in layout work;

3、Improve the quality and reliability of products and increase the yield rate of mass-produced products.

4、Pay close attention to the most cutting-edge technologies and products in the field of motor drive, and make suggestions on the technological direction and product planning of the product line;

5、Evaluate, simulate, and analyse motor drive circuit structures and circuit topologies;

6、Collaborate with AE Application Engineer/PE Process Engineer for product testing and application solution development, defining optimal characteristics and test conclusions;

Requirements：

1、Master degree or above, majoring in Microelectronics and Solid State Electronics/Integrated Circuits/Electronic Science and Technology/Electronic Communication, preferably from famous foreign universities, 985 or 211 universities;

2、More than 5 years of direct experience in analogue/digital-analogue hybrid IC design, familiar with related EDA tools, solid analogue IC foundation, experience in HALL, Motor Driver IC, Fan Motor Driver IC, DC/DC, AC/DC, VCM, OIS, LDO, Bandgap, OP, Comparator, POR, control chip design is preferred;

3、Familiar with CMOS, LDMOS process, high voltage process and BCD process, proficient in GATE DRIVE and crossover/ocp design;

4、Experience in designing automotive grade motor driver chips is preferred;

5、Team management experience, strong teamwork spirit, experience working in a project based, product orientated team;